BYK® -P 9080

BYK®-P 9080 by BYK is a processing additive for low-profile and class A SMC systems with mold release properties. It is a combination of surface-active substances and polymers. It stabilizes the compound and improves the flow behavior. Due to its excellent mold release properties, it completely replaces traditional release agents. BYK®-P 9080 brings about both an improved surface quality of the component as well as a better coating adhesion and adhesive bonding. It is especially recommended for SMC (low-profile) & Class A SMC and recommended for SMC (low-shrink). The recommended level is 4-5 % additive (as supplied) based on the total resin. It is listed in EINECS, TSCA, ENCS, PICCS, NZIoC and ECSI. It complies with EU Directive 2002/95/EC (RoHS), EU Directive 2002/96/EC (WEEE), EU-Directive 94/62/EC (Packaging waste), CONEG Toxics in Packaging, EU Directive 2011/65/EC (RoHS 2) and REACH Regulation (EC) No 1907/2006. The shelf life of this product is 36 months.