Participate in this unique event presented by two experts in the field of heat management using TCP from Momentive Performance Materials Allison yeske (Global Technical Marketing Manager, Ceramics) and Dr. Chandrashekar (Chandra) Raman (Global Technology Platform Leader, Boron Nitride in Polymers).
Allison and Chandra will:
Make the case for TCP vs. metal in thermal management applications to help you meet the demands of performance, system miniaturization and weight savings
Explain why BN is the best choice in thermoplastic applications requiring thermal conductivity and electrical insulation
Show how to formulate & compound thermally conductive plastics to optimize your cost / performance ratio using the recently developed CoolFX™ hybrid fillers
Present potential applications for thermally conductive plastics