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Conductive Fillers & Fibers > Boron Nitrides

7

News related to Conductive Fillers & Fibers > Boron Nitrides

Sep 21, 2021 |Product News
3M Launches Boron Nitride Cooling Fillers for Thermal Management

Jul 24, 2020 |Industry News
Successful Production of Monoisotopic Hexagonal Boron Nitrides at Room Temperature

Jul 24, 2020 |Industry News
New Amorphous Boron Nitride Shows Potential Application in Semiconductors

Apr 29, 2019 |Industry News
New Research Functionalizes White Graphene without Using Strong Chemical

Mar 5, 2019 |Industry News
Grolltex Expands Capacity for CVD Monolayer Graphene Fabrication Facility

7

Articles related to Conductive Fillers & Fibers > Boron Nitrides

Jul 20, 2020 |Article
Graphene & 2D Materials: Technology and Market Update - By Donald Rosato

May 6, 2016 |Article
How Additives Help Meet Current E&E Trends: Part II - By Sreeparna Das

Sep 17, 2014 |Article
Electronic applications requiring more than Heat Dissipation: How can you fulfill their need? - By Mark DeMeuse

Jan 3, 2014 |Article
Silanes and their Use with Boron Nitride Powders - By Donald McNally

Sep 26, 2013 |Article
Extrusion Compounding and Boron Nitride - By Donald McNally

69

Product Name

Supplier

Description

Boron Nitride BO

Accuratus

Boron nitride. It contains boric oxide binder system which absorbs moisture and causes swelling as well as property degradation. Has high thermal conductivity, low thermal expansion, good thermal... view more

Applications

Electronics / Computers>Electronic components
Safety, regulation & environment
Mechanical/ physical performance>Electrical resistance

Boron Nitride CA

Accuratus

Boron nitride. It contains calcium borate binder system which offers moisture resistance. Has high thermal conductivity, low thermal expansion, good thermal shock resistance, as well as high... view more

Applications

Electronics / Computers>Electronic components
Safety, regulation & environment
Mechanical/ physical performance>Electrical resistance

Boron Nitride XP

Accuratus

Boron nitride. It does not contain binders and has high thermal conductivity, low thermal expansion, good thermal shock resistance, as well as high electric resistance. Boron Nitride XP is... view more

Applications

Electronics / Computers>Electronic components
Mechanical/ physical performance>Electrical resistance
Safety, regulation & environment

HI-COOL TCF BNF 30

Carl Spaeter

HI-COOL TCF BNF 30 by Carl Spaeter is a hexagonal boron nitride-based thermally conductive filler. It offers excellent heat dissipation, low thermal expansion coefficient compared to mineral fillers, high... view more

Applications

Epoxy, Epoxide Resin
Electrical markets>Housings
Electronics / Computers
Injection molding - thermoplastics

HI-COOL TCF BNS 120

Carl Spaeter

HI-COOL TCF BNS 120 by Carl Spaeter is a thermally conductive filler. It is randomized agglomerates of boron nitride platelets with spherical shape. It exhibits outstanding workability, high flowability and... view more

Applications

Compoundings

CarboTherm™ CTF₅

Ceramic Materials (Saint-Gobain Group)

CarboTherm™ CTF₅ by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure... view more

Applications

Other Thermoplastic
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting

...

CarboTherm™ CTL₃₀

Ceramic Materials (Saint-Gobain Group)

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Applications

Other Thermoplastic
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics

...

CarboTherm™ CTP₁₂

Ceramic Materials (Saint-Gobain Group)

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Applications

Other Thermoplastic
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics

...

CarboTherm™ CTP₁₆

Ceramic Materials (Saint-Gobain Group)

CarboTherm™ CTP₁₆ by Ceramic Materials (Saint-Gobain Group) acts as a filler. It is boron nitride that offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure... view more

Applications

Other Thermoplastic
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting

...

CarboTherm™ CTP₂

Ceramic Materials (Saint-Gobain Group)

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Applications

Other Thermoplastic
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics

...

CarboTherm™ CTP₃₀

Ceramic Materials (Saint-Gobain Group)

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Applications

Other Thermoplastic
Electronics / Computers>Printed circuit boards
Electronics / Computers>Housings
Conversion of composites & thermosets>Potting

...

CarboTherm™ CTP₈

Ceramic Materials (Saint-Gobain Group)

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Applications

Other Thermoplastic
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting

...

CarboTherm™ CTPO₅

Ceramic Materials (Saint-Gobain Group)

CarboTherm™ CTPO₅ by Ceramic Materials (Saint-Gobain Group) acts as a filler. It is boron nitride that offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure... view more

Applications

Other Thermoplastic
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics

...

CarboTherm™ CTS₂₀M

Ceramic Materials (Saint-Gobain Group)

Boron nitride. CarboTherm™ CTS₂₀M by Ceramic Materials (Saint-Gobain Group) acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm™ CTS₂₀M provides high thermal... view more

Applications

Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting

...

CarboTherm™ CTS₂₅M

Ceramic Materials (Saint-Gobain Group)

Boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® CTS25M provides high thermal conductivity, excellent... view more

Applications

Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting

...

View all 69 products in Conductive Fillers & Fibers > Boron Nitrides

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