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Dynamar™ HC 1101

Technical Datasheet | Supplied by 3M-Dyneon
Demonstrated benefits in specialized extrusion and calendering processes. It is useful at reducing die pressure, reducing die build-up, and promoting release from calendering rolls. Melt fracture elimination, die build-up reduction, gel reduction, improved pigment dispersion. This epoxy currative is a linear polyether diprimary amine which contains tetramethylene oxide as the principal recurring unit and has a molecular weight of approximately 10,000. High tensile strength and elongation. Hydrolitic stability. Adhesion properties similar to epoxy resins. Excellent abrasion resistance. High resilience and low heat build-up during dynamic use. Wide range of available hardnesses.
Product Type
Processing Aids > Polymeric Processing Aids
Chemical Composition
linear polyether diprimary amine
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