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ADMAFINE® SO-C1

Technical Datasheet | Supplied by Toyotsu Chemiplas
ADMAFINE® SO-C1 distributed by Toyotsu Chemiplas and manufactured by Admatechs is silica filler. It is manufactured by vaporized metal combustion (VMC) method. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. Used in precise plastic molding applications including camera modules, connectors and 3D printers. Improves flatness, abrasion & impact resistance, anisotropy and modulus. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. Exhibits good rigidity, slidability, thixotropy and dilatancy. Offers low heat expansion, high heat conductivity and heat resistance. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. ADMAFINE® SO-C1 is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness.
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ADMAFINE® SO-C1
Technical Datasheet | Supplied by Toyotsu Chemiplas
REQUEST A SAMPLE CONTACT SUPPLIER
Product Type
Fillers > Silicas
Chemical Composition
Silica
Physical Form
Particle, Fine spherical
Product Status
COMMERCIAL
Applications/ Recommended for
  • Epoxy, Epoxide Resin
  • Electronics / Computers > Printed circuit boards
  • Electrical markets > Connectors
  • Polymer Conversion > Thixotropy
  • Mechanical/ physical performance > Thermal resistance
  • Polymer Conversion > Dispersion
  • Mechanical/ physical performance > Impact resistance
  • Mechanical/ physical performance > Dimensional stability

ADMAFINE® SO-C1 Properties

Property

Value & Unit
Test Condition
Test Method
Surface Area
10 - 20 m2/g
Electrical Conductivity
< 15 µS/cm
Aluminum Content
< 700 ppm

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