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CNS Encapsulated Flakes

CNS Encapsulated Flakes by Applied NanoStructured Solutions is produced using a proprietary ANS process. The ANS process creates cross-linked multiwall carbon nanotube-based networks of CNS with a distinctive morphology that, when added to polymers, elastomers and thermoplastics, enhance the resulting products with multifunctional properties, such as increased conductivity and dramatically improved strength and modulus. It is a structure comprised of a multitude of cross-linked and entangled carbon nanotubes. It has uniform dispersion, electrical conductivity, increased tensile strength and excellent flowability. It has polyurethane, polyimide and polyamide sizing type. Provides significant improvements to electromagnetic interference (EMI) shielding. Possesses multi-resin compatibility. It is designed for use as reinforcement for PC, ABS, thermoset and thermoplastic resins. Its applications include consumer electronics, sporting goods automotive, aviation, construction, aerospace and defence. CNS Encapsulated Flakes is listed in TSCA.
Product Type
  • Conductive Fillers & Fibers
  • Nanoparticles > Carbon Nanotubes > Multi Wall Carbon Nanotubes
Chemical Composition
Carbon Nanotubes
Physical Form
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