BYK® -P 9065

BYK®-P 9065 by BYK is a processing additive for low-shrink SMC and BMC/DMC with mold release properties. It is a combination of surface-active substances and polymers. The zinc stearate that is usually used as a mold release agent is completely replaced by the additive, which simplifies raw material handling. Separation of the LS-SMC/BMC compounds is avoided and thus cobwebbing is reduced. Scrap rate is lowered due to reduced shrinkage and less warping. This is supported by higher gloss, lower haze, improved color homogeneity and a generally higher surface appearance of the finished parts. If the finished parts are to be painted or bonded, no sanding is required, as BYK®-P 9065 is firmly anchored in the cured resin and does not migrate to the surface. Due to the low dosage of the additive, it is virtually cost-neutral. The recommended level is 2-2.5% additive (as supplied) based on the total resin; up to 4% for very highly filled systems. It is listed in EINECS, TSCA, ENCS, NZIoC and ECSI. It is in line with EU Directive 2011/65/EC (RoHS 2), EU Directive 2002/96/EC (WEEE), EU Directive 94/62/EC (Packaging Waste) and CONEG Toxics in Packaging. It complies with REACH Regulation (EC) No 1907/2006. The shelf life of this product is 36 months.