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BYK® -P 9065

Technical Datasheet | Supplied by Byk (Altana Group)
BYK® -P 9065 by Byk (Altana Group) is a Combination of surface-active substances and polymers. Acts as a processing aid. Exhibits mold release properties. The zinc stearate that is usually used as a mold release agent is completely replaced by the additive, which simplifies raw material handling. Scrap rate is lowered due to reduced shrinkage and less warping. This is supported by higher gloss, lower haze, improved color homogeneity and a generally higher surface appearance of the finished parts. If the finished parts are to be painted or bonded, no sanding is required, as BYK-P 9065 is firmly anchored in the cured resin and does not migrate to the surface. Due to the low dosage of the additive, it is virtually cost neutral. Recommended for low-shrink SMC and BMC/DMC. It is listed in TSCA, REACH (1907/2006), EINECS, ENCS, NZIoC, ECSI, RoHS (2002/95/EC), WEEE (2002/96/EC), CONEG, RoHS 2 (2011/65/EC). Typical level of BYK® -P 9065 ranges from 2-2.5% (as supplied) based on the total formulation.
Product Type
Processing Aids > Polymeric Processing Aids
Chemical Composition
Combination of surface-active substances and polymers
Physical Form
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