CarboTherm™ CTP₈

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to align with the direction of flow in polymer processing which makes it best fit for heat spreading applications such as three dimensional injection molding thermoplastics utilizing high shear processing. CarboTherm® CTP8 provides high thermal conductivity, excellent dielectric strength, low density and low dielectric constant. Exhibits high lubricity which results in reduction of wear and tear of processing equipment. Used in potting compounds and thermal interface materials. Can also be used in printed circuit board prepregs, gap fillers, compliant pads, solid state lighting/LEDs as well as electronics and power devices. It is often utilized in cost demanding applications.