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Polymer Additives

Amicure® CG-325G

Technical DataSheet | Supplied by Evonik

Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355 °F to 203 °F with appropriate accelerator selection. It contains 1.5% of an inert flow control additive to inhibit clumping and improve handling. Exhibits excellent dispersibility in liquid epoxy resin due to higher levels of flow additive. Used for recreational and industrial pre-preg composites. Its recommended usage level (EEW=190) is 4-15 phr.

Amicure® CG-325G Product details

Product Type
xxxxxxxxxxxxxxxxxxxxxxxxx
Chemical Composition
xxxxxxxxxxxxx
Physical Form
Crystals
Appearance
White
Product Status
xxxxxxxxxx
Applications/ Recommended for
  • xxxxxxxxxxxxxxxxxxxx
  • xxxxxxxxxxxx
  • xxxxxxxxxxxxxxxxxxxxxxxxx

Amicure® CG-325G Properties

Property

Value & Unit
Test Condition
Test Method
Melt point
xxxxxxxxx °F
Equivalent Wt/{H}
xx
Particle size, 90%
xxx microns
Particle size, 50%
xxx microns
Nitrogen in dicyandiamide
xx %
Glass transition temperature (Tg), measured using DSC with 18 °F/ min ramp
xxx °F
Glass transition temperature (Tg), when accelerated with Ancamine 2441
xxx °F
Last edited Feb 2, 2017
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