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Polymer Additives
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Technical Datasheet | Supplied by Nippon Soda
NISSOCURE® TIC-188 acts as an inclusion catalyst using imidazole as guest molecules as well as curing agent for epoxy resins. It is stable at room temperature, has a longer pot life. Used in epoxy molding compounds for semiconductor packages.
Product Type
Crosslinkers / Curing Agents / Hardeners
Product Status
Applications/ Recommended for
Epoxy, Epoxide Resin
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