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NISSOCURE® TIC-188

Technical DataSheet | Supplied by Nippon Soda

NISSOCURE® TIC-188 acts as an inclusion catalyst using imidazole as guest molecules as well as curing agent for epoxy resins. It is stable at room temperature, has a longer pot life. Used in epoxy molding compounds for semiconductor packages.

NISSOCURE® TIC-188 Product details

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Last edited Dec 18, 2017
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