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Polymer Additives
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23 products match your search
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Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® CTS20M provides high thermal conductivity, excellent... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® CTS25M provides high thermal conductivity, excellent... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® CTS2M provides high thermal conductivity, excellent... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® CTS7M provides high thermal conductivity, excellent... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits high thermal conductivity, excellent electrical insulation, high strength-to-weight ratio, excellent corrosion resistance and recycling options... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® PCTH10MHF... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® PCTH3MHF... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® PCTH7MHF... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits hexagonal crystal structure and offers high thermal conductivity, excellent electrical insulation, high strength-to-weight ratio, as well as an excellent... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits hexagonal crystal structure and offers high thermal conductivity, excellent electrical insulation, high strength-to-weight ratio, as well as an excellent... view more
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It offers an optimum combination of thermal conductivity and mechanical performance. It exhibits high strength-to-weight ratio along with an excellent electrical... view more
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