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The material selection platform
Polymer Additives
The material selection platform
Polymer Additives
by SpecialChem
 
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Products Compatible with Akrosperse® THIO #1-75/EPR/S

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.

Technicure®

Polymers additives supplied by AC Catalysts

19 products match your search
Product Name
Supplier
Description
A&C Catalysts
Technicure® 101 by A&C Catalysts is an imidazole epoxy adduct. Acts as a curing agent. It is compatible with epoxy resins when co-extruded or as a hot melt dispensed system. Easily solubilized in epoxy... view more
A&C Catalysts
Technicure® EMI-24LV by A&C Catalysts is 2-Ethyl-4-methylimidazole. It acts as an epoxy catalyst and curing agent. It also delays the cross-linking of polyester reactions. Technicure® EMI-24LV is used in coatings... view more
A&C Catalysts
Technicure® IPDU-8 by A&C Catalysts is an N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea. It is substituted urea. It is a dicyandiamide (DICY) cure accelerator. Used in... view more
A&C Catalysts
Technicure® LC-100 by A&C Catalysts is an encapsulated modified imidazole designed for one-component epoxy formulations. It can be used as a sole curing agent or as an accelerator for dicyandiamide, anhydride... view more
Technicure® Nano-Dicy is a pulverized grade of dicyandiamide with an average particle size of about 1-2 micron. Acts as a curing agent. Provides excellent adhesion to a variety of substrates and has... view more
A&C Catalysts
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in composites... view more
1-(2-Cyanoethyl)-2-ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to brownish liquid. It is used as catalyst providing extended latenccy and compatibility... view more
A&C Catalysts
Epoxy amine adduct. It acts as curing agent and accelerator for dicyandiamide, anhydrides, DDS or other imidazoles, decreasing the cure temperature. It is fine free flowing powder which can be used... view more
A&C Catalysts
HSP Distance: 0
Technicure® 54 by A&C Catalysts is a 2,4,6-tris(dimethylaminomethyl) phenol. Acts as a cure accelerator. Suitable for polyamides, amido amines, anhydrides and polycarboxylic acids. It has low viscosity and... view more
A&C Catalysts
HSP Distance: 0
Technicure™ TDU-200M by A&C Catalysts is a [1,1’- (4-methyl-m-phenylene)bis-(3,3-dimethyl)] urea, is a substituted urea. Technicure™ TDU-200M is a dicyandiamide (DICY) accelerator. Provides good... view more
A&C Catalysts
HSP Distance: 0
Dicyamdiamide. It acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more
A&C Catalysts
HSP Distance: 0
Dicyamdiamide. It acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more
A&C Catalysts
HSP Distance: 0
Dicyamdiamide. It acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more
A&C Catalysts
HSP Distance: 0
1,1'-(4 methyl-m-phenylene) bis(3,3 dimethyl urea). It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It... view more
A&C Catalysts
HSP Distance: 1.9
Technicure® MDU-11M by A&C Catalysts is a [4,4’- (methylene bis (phenyl dimethyl)] urea, is substituted urea. It is a dicyandiamide (DICY) accelerator. Used in composites such as pre-pregs and powder coatings... view more
A&C Catalysts
HSP Distance: 1.9
4,4’ Methylene bis (phenyl dimethyl urea). It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides... view more
A&C Catalysts
HSP Distance: 3.5
Technicure® DCMU by A&C Catalysts is a 3-(3,4-chlorophenyl)-1,1-dimethylurea, which is substituted urea. It is a dicyandiamide (DICY) accelerator. Used in composites such as pre-pregs and powder coatings... view more
A&C Catalysts
HSP Distance: 3.9
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 3.9
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
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