Amicure® CG-325G by Evonik is a latent curing agent for epoxy resins. It is a micronized grade of dicyandiamide containing 1.5% of an inert flow control additive offering inhibit clumping and... view more

AMICURE® CG-NA by Evonik acts as a latent curing agent for epoxy resins. Used in electrical laminates and solvent-based pre-preg composites. Activation temperature can be varied from 356°F to 203°F... view more

Amicure® CG-1200G by Evonik acts as a latent curing agent for epoxy resins. It contains 1.5% of an inert flow control additive to inhibit clumping and improve handling. Fine particle size provides... view more

Dabco® Crystalline by Evonik is a crystalline, 100% solid triethylene diamine (TEDA)-based catalyst with high-purity. Used in all types of polyurethane foams including flexible slabstock, flexible... view more

Dicyanex® 1400B by Evonik is a crosslinking agent. It is a micronized grade of dicyandiamide. Suitable for epoxy resin. Used in recreational and industrial pre-preg composites... view more

Amicure® CG-1400 by Evonik is a micronized grade of dicyandiamide based latent curing agent for epoxy resins. It contains 0.5% of an inert flow control additive to inhibit clumping and improve... view more

Dicyanex® 200-X by Evonik is a curing agent for epoxy resins in solvent-based processes. It is a pulverized grade of dicyandiamide. It offers enhanced solubility in polar solvents, such as acetone... view more

Dicyanex® 325 by Evonik is epoxy curing agent for epoxy resins. It a pulverized grade of dicyandiamide containing 3% of an inert flow control additive to inhibit clumping and improve handling. It... view more