Ancamide® 1618 by Evonik is a low color, low viscosity curing agent and modifier. Ideal for ambient or low temperature curing of liquid epoxy resins. Designed for high gloss films, tank and... view more

Ancamide® 1638 by Evonik is a very low viscosity curing agent and modifier. Designed for use with liquid epoxy resin cured at ambient or elevated temperature. Also used as an accelerator for other... view more

Ancamide® 2443 by Evonik is a low viscosity, plasticizer-free epoxy curing agent and modifier by Evonik. It enables the development of high-performance formulations that can be applied via... view more

Ancamide® 261A by Evonik acts as epoxy curing agent and modifier. It is characterized by good color, color stability and excellent corrosion resistance. It is a high-viscosity polyamide designed for... view more

Ancamide® 2739 by Evonik acts as a curing agent for industrial flooring applications. Ideal for diluted liquid epoxy resin at ambient and low temperature application at 10°C. It is free of... view more

WPI-113 by FUJIFILM Wako Pure Chemical is a heavy metal-free, photo cationic initiator. It can generate HPF6 and is used for epoxy curing. It shows high compatibility with resins and low toxicity. WPI-113 is... view more

WPI-116 by FUJIFILM Wako Pure Chemical is a photo cationic initiator. It can generates hexafluoroantimonic acid. It shows higher curing performance with a small amount of addition. It is used for epoxy curing. It... view more

WPI-124 by FUJIFILM Wako Pure Chemical is a heavy metal-free, photo cationic initiator. It can generate HPF6. It is used for epoxy curing. It shows high compatibility with resins and low toxicity. WPI-124 is... view more