GC TBBPA 59 by GreenChemicals is tetrabromo bisphenol A flame retardant. It is used in manufacturing of printed circuit boards found in electrical appliances. It can be used as an intermediate for... view more

Lapox® ASH-10 FF by Atul is a non-volatile curing agent with epoxy resins specially to obtain slow reactivity and extended pot life of mix. It is white to off-white, odorless, non-volatile... view more

Lapox® ASH-10 MIC by Atul is a non-volatile micronised powder suitable to disperse uniformly in epoxy resins. It acts as aromatic amine curing agent. Offers slow reactivity and extended pot life of... view more

Lapox® ASH-11 by Atul is a white to brownish, odorless, non-volatile crystalline powder. It is used as aromatic amine curing agent with epoxy resins specially to obtain faster reactivity than... view more

Lapox® ASH-11 MIC by Atul is an aromatic amine curing agent with fast reactivity than 4,4’-DDS. It is off-white to yellowish-brown, odorless, non-volatile micronised powder suitable to disperse... view more

Biofr TBBA by Bioray Chem is tetrabromobisphenol A. Acts as a brominated aromatic flame retardant used in thermoplastic and thermoset resin systems. Is highly effective when reacted into epoxy resin... view more

CarboTherm™ CTF₅ by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure... view more

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

CarboTherm™ CTP₁₆ by Ceramic Materials (Saint-Gobain Group) acts as a filler. It is boron nitride that offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure... view more

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Exolit® OP 930 by Clariant is an organic, non-hygroscopic phosphinate. Acts as a halogen-free, flame retardant with high phosphorus content. Exhibits high thermal stability and low smoke toxicity... view more

NT-T55-2 by Niutang acts as a curing agent and stabilizer. It is bis (N, N’-2-hydroxyethyl) hexandiamine. Exhibits high chemical resistance and excellent reaction activity. Helps in extrusion... view more

Phosphazene by Otsuka Chemical is an environment friendly, non-halogen flame retardant. It offers outstanding hydrolysis resistance and excellent heat resistance. It shoes compatibility with PC... view more