Coupling agent for epoxy resins on glass fabrics in printed circuit board composites... view more

Hydrolyzed vinylbenzylaminoethylaminopropyltrimethoxy silane (40% in methanol). It is a low chloride version of Dow Corning® Z-6132 Silane... view more

Imicure® EMI-24 by Evonik functions as both a curing agent and a cure accelerator for high-performance epoxy resin systems. Used in printed circuit board laminates, filament winding applications and... view more

Phosphorus based flame retardant. It contains reactive phenolic end groups for incorporation into resins. Nofia™ OL1001 is transparent and is highly soluble in the typical solvents used in thermoset... view more

Phosphorus based flame retardant. It contains reactive phenolic end groups for incorporation into resins. Nofia® OL3001 is transparent and is highly soluble in the typical solvents used in thermoset... view more

NIKANOL® H by Fudow (a group company of Mitsubishi Gas Chemical) functions as tackifier. It is a high viscosity, straight type oligomer provided by m-xylene and formaldehyde. Designed for... view more

NIKANOL® L by Fudow (a group company of Mitsubishi Gas Chemical) is a high viscosity leveling agent. Offers stickiness, tackiness, initial adhesion, flexibility, wettability and damping property... view more

Reactive epoxidized soybean oil. Acts as a processing stabilizer or an auxiliary plasticizer for PVC. Applicable to insulating PVC wire & cable compound, PCB, etc... view more

Epoxidized soybean oil. Acts as a plasticizer and stabilizer for polyvinyl chloride and exhibits good heat as well as light stability. As a substitution of phthalate plasticizer, it has a great... view more

Epoxidized soybean oil. Acts as a plasticizer and stabilizer for polyvinyl chloride and exhibits good heat as well as light stability. As a substitution of phthalate plasticizer, it has a great... view more

MARTINAL® ON-310 by Huber Engineered Materials is aluminium trihydroxide. It is a flame retardant and work as a filler in thermosetting plastics and liquid dispersions... view more

Aluminum hydroxide. Used in laminates for printed wire boards. Possesses increased-thermal-stability... view more

Araldite® MT 35600 by Huntsman Advanced Materials is bisphenol-A based benzoxazine thermoset resin. Acts as a heat stabilizer. Can be homopolymerized or co-react with an epoxy or phenol resin... view more

Fyrol® 6 by ICL Industrial is diethyl-N, N-bis (2-hydroxyethyl) aminomethylphosphonate. It is designed for use as a reactive flame retardant in polyurethane foams and urethane elastomers. It is... view more

Emerald™ 2000 by Lanxess is a combination of flame retardant and curing agent for non-halogen PCB epoxy laminates. It offers a single source for curing and flame retardant needs. This product... view more

1,2-Epoxy-4(2-oxiranyl)-cyclohexane of 2,2-bis(hydoroxymethyl)1-butanol. It acts as a curing agent. It has an extremely small amount of ionic substances devoid of sodium or chlorine ions. The... view more

Boron nitride. Acts as a conductive filler. It is a high-purity single crystal grade. It is of low surface area and high crystallinity. Offers high thermal conductivity, high temperature stability... view more

PolarTherm™ Boron Nitride Powder-PT140 by Momentive Performance Materials is a boron nitride grade. Acts as a conductive filler. Contains single-crystal hexagonal platelets. It is of high purity. Provides unique combination of thermal, electrical... view more

PolarTherm™ Boron Nitride Powder-PT160 by Momentive Performance Materials is a boron nitride grade. Acts as a conductive filler. It is of high purity. Contains single-crystal hexagonal platelets. Provides unique combination of thermal, electrical... view more

PolarTherm™ Boron Nitride Powder-PT180 by Momentive Performance Materials is a boron nitride grade. Acts as a conductive filler. It is of high purity containing single-crystal hexagonal platelets. Provides unique combination of thermal, electrical... view more