Ancamine® 1608 by Evonik is a modified aliphatic polyamine adduct based curing agent designed for for epoxy resin. Provides excellent chemical resistance against trichloroethane, xylene, water... view more

Ancamine® 1637-LV by Evonik is a rapid curing agent used in laminates. It is non-corrosive with rapid cure speed. Ancamine® 1637-LV offers very good resistance to solvents, inorganic acids and... view more

Ancamine® 1768 is a rapid ambient or low temperature curing agent by Evonik. Used as an accelerator for other amine-based curing agents and crack injection. Possesses fast cure at ambient and low... view more

Ancamine® 1769 by Evonik is a hydroxyalkylated polyamine curing agent. Used in electrical pottings and castings, wet lay-up laminating and tooling. It is DOT non-corrosive and offers good mechanical... view more

Ancamine® 1784 is a modified aliphatic amine curing agent by Evonik. Used in castings and laminates. Offers long pot life and good impact resistance... view more

Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides... view more

Ancamine® 2071 by Evonik is a rapid setting, phenol-free, epoxy curing agent and modifier. It also functions as an accelerator for other amine-based curing agents. Offers very fast property... view more

Ancamine® 2205 by Evonik is a phenol-free, curing agent. It is an accelerated modified aliphatic amine curative intended for use with liquid epoxy resins in two-part ambient or low-temperature cure... view more

Ancamine® 2264 by Evonik is epoxy curing agent. It exhibits some of the beneficial properties of both cycloaliphatic and aromatic amines. It is an ideal alternative to aromatic diamines in the... view more

Ancamine® 2337S by Evonik is a modified aliphatic amine, a latent curing agent for epoxy resins. It offers very rapid reactivity, rapid green strength development and excellent shelf stability in... view more

Ancamine® 2390 by Evonik is a low-viscosity modified amine curing agent designed for liquid epoxy resin. It yields formulations with high elongation, strength, and hardness. It offers one-to-one mix... view more

Ancamine® 2441 by Evonik is a modified polyamine-based crosslinking agent. Used in potting compounds. Offers very good reactivity. Provides improved green strength development. Possesses good... view more

Ancamine® 2442 is a modified polyamine crosslinker by Evonik. Used in potting compounds. Offers very good reactivity. Provides improved green strength development. Possesses good formulation shelf... view more

Ancamine® 2450 is a cycloaliphatic amine crosslinker by Evonik. Used in filament winding, wet lay-up laminating and potting compounds. Offers higher glass transition temperature. Possesses low... view more

Ancamine® K54 by Evonik is a crosslinker based on 2,4,6-tris (dimethylaminomethyl) phenol. It is an efficient tertiary amine activator for epoxy resins cured with a wide variety of hardener types... view more

Ancamine® T by Evonik is a crosslinking agent based on N-(2-hydroxy ethyl)diethylene triamine. Acts as an ambient or elevated temperature curing agent for use with liquid epoxy resins. Possesses... view more

Ancamine® Z curing agent is a curing agent by Evonik. Offers very good chemical resistance. Designed for electrical and electronic encapsulation, tooling, laminates and composites, filament wound... view more

CUREZOL® 1B2MZ by Evonik is imidazole curing agent for epoxy resins. It is a low viscosity accelerator. Designed for potting and encapsulation in electrical and electronic applications. CUREZOL®... view more

CUREZOL® 2E4MZ by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Possesses rapid... view more

CUREZOL® 2MA-OK by Evonik acts as an accelerator. Offers single package latency from several hours to greater than six months. It also functions as an accelerator in the reaction between epoxy... view more