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The material selection platform
Polymer Additives
The material selection platform
Polymer Additives
by SpecialChem
 
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67 products match your search
Product Name
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Ancamide® 3034 by Evonik acts as an epoxy curing agent and a modifier. It provides moderate pot life and good adhesion to substrates. Ancamide® 3034 is suitable for casting resins. It can be stored for 24... view more
Ancamide® 350A by Evonik is a standard reactive liquid polyamide curing agent for epoxy resins. It is suitable for encapsulation and castings. It provides low viscosity, higher imidazoline content and... view more
Ancamide® 500 is an aliphatic amidoamine-based curing agent. Offers low viscosity, long pot life and less critical loading. Shows good adhesion to concrete... view more
Ancamide® 502 is a low viscosity curing agent by Evonik. It has a relatively long pot life... view more
Ancamide® 506 by Evonik is an amidoamine curing agent with a very high imidazoline content. Used in castings and laminates. Offers low viscosity. Provides very long pot life and low exotherm... view more
Ancamide® 507 by Evonik acts as a polyfunctional curing agent. It is based on a fatty amidoamine for use in curing liquid epoxy resins. Ancamide® 507 exhibits fast cure and good water resistance... view more
Ancamide® 512 by Evonik is an aliphatic amidoamine curing agent. It is designed for use with epoxy resin at elevated temperatures. It can be used alone and in a mixture with other amine-based curing... view more
Ancamide® 910 is a versatile and flexible hardener by Evonik. Used for electronic potting and encapsulation compounds. Offers very good flexibility/peel strength. Provides very good thermal shock... view more
Ancamine® 1110 by Evonik is dimethylaminomethylphenol-based catalyst. Designed for anhydride cures in castings and laminates and epoxy/polysulfide... view more
Ancamine® 1482 by Evonik acts as a curing agent for liquid epoxy resins. Exhibits excellent chemical and heat resistance. Provides long pot life and can be mixed at room temperature. Ancamine® 1482... view more
Ancamine® 1608 by Evonik is a modified aliphatic polyamine adduct based curing agent designed for for epoxy resin. Provides excellent chemical resistance against trichloroethane, xylene, water... view more
Ancamine® 1637-LV by Evonik is a rapid curing agent used in laminates. It is non-corrosive with rapid cure speed. Ancamine® 1637-LV offers very good resistance to solvents, inorganic acids and... view more
Ancamine® 1768 is a rapid ambient or low temperature curing agent by Evonik. Used as an accelerator for other amine-based curing agents and crack injection. Possesses fast cure at ambient and low... view more
Ancamine® 1769 by Evonik is a hydroxyalkylated polyamine curing agent. Used in electrical pottings and castings, wet lay-up laminating and tooling. It is DOT non-corrosive and offers good mechanical... view more
Ancamine® 1784 is a modified aliphatic amine curing agent by Evonik. Used in castings and laminates. Offers long pot life and good impact resistance... view more
Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides... view more
Ancamine® 2071 by Evonik is a rapid setting, phenol-free, epoxy curing agent and modifier. It also functions as an accelerator for other amine-based curing agents. Offers very fast property... view more
Ancamine® 2205 by Evonik is a phenol-free, curing agent. It is an accelerated modified aliphatic amine curative intended for use with liquid epoxy resins in two-part ambient or low-temperature cure... view more
Ancamine® 2264 by Evonik is epoxy curing agent. It exhibits some of the beneficial properties of both cycloaliphatic and aromatic amines. It is an ideal alternative to aromatic diamines in the... view more
Ancamine® 2390 by Evonik is a low-viscosity modified amine curing agent designed for liquid epoxy resin. It yields formulations with high elongation, strength, and hardness. It offers one-to-one mix... view more
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