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Product Name
Supplier
Description
Ancamine® 1482
Evonik
Ancamine® 1482 by Evonik acts as a curing agent for liquid epoxy resins. Exhibits excellent chemical and heat resistance. Provides long pot life and can be mixed at room temperature. Ancamine® 1482...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Filament winding1
Laminating
Conversion of composites & thermosets>Potting
Ancamine® 1922A
Evonik
Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® 2450
Evonik
Ancamine® 2450 is a cycloaliphatic amine crosslinker by Evonik. Used in filament winding, wet lay-up laminating and potting compounds. Offers higher glass transition temperature. Possesses low...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Laminating
Conversion of composites & thermosets>Filament winding1
Ancamine® T
Evonik
Ancamine® T by Evonik is a crosslinking agent based on N-(2-hydroxy ethyl)diethylene triamine. Acts as an ambient or elevated temperature curing agent for use with liquid epoxy resins. Possesses...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Encapsulating
Conversion of composites & thermosets>Potting
Laminating
Ancamine® 2709
Evonik
Ancamine® 2709 by Evonik is a curing agent. It is a tertiary amine based cure accelerator. It imparts rapid cure at elevated temperatures. It is designed for dicyandiamide and anhydride cured epoxy...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Polymer surface adhesion>Adhesion to substrates
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