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27
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Product Name
Supplier
Description
CarboTherm™ CTS
20
M
Ceramic Materials (Saint-Gobain Group)
Boron nitride. CarboTherm™ CTS
20
M by Ceramic Materials (Saint-Gobain Group) acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm™ CTS
20
M provides high thermal...
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Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting
...
CarboTherm™ CTS
25
M
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® CTS25M provides high thermal conductivity, excellent...
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Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting
...
CarboTherm™ CTS
2
M
Ceramic Materials (Saint-Gobain Group)
CarboTherm™ CTS
2
M by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm™ CTS
2
M provides high thermal...
view more
Applications
Other Thermoset
Electronics / Computers>Printed circuit boards
Electronics / Computers>Housings
Injection molding - thermoplastics
...
CarboTherm™ CTS
7
M
Ceramic Materials (Saint-Gobain Group)
CarboTherm™ CTS
7
M by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. It provides high thermal conductivity...
view more
Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics
...
CarboTherm™ PCTH
10
MHF
Ceramic Materials (Saint-Gobain Group)
CarboTherm™ PCTH
10
MHF by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic...
view more
Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics
...
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all Ceramic Materials (Saint-Gobain Group)
products matching your search
Ancamine® 2014FG
Evonik
Ancamine® 2014FG by Evonik is a latent curing agent based on a modified polyamine. It is used as an accelerator for dicyandiamide (DICY). It is a fine-grind version of Ancamine® 2014AS curing agent...
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Applications
Conversion of composites & thermosets>Potting
Polymer surface adhesion>Adhesion to substrates
Ancamine® 2337S
Evonik
Ancamine® 2337S by Evonik is a modified aliphatic amine, a latent curing agent for epoxy resins. It offers very rapid reactivity, rapid green strength development and excellent shelf stability in...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Polymer Conversion>Dispersion
Polymer surface adhesion>Adhesion to substrates
Ancamine® 2441
Evonik
Ancamine® 2441 by Evonik is a modified polyamine-based crosslinking agent. Used in potting compounds. Offers very good reactivity. Provides improved green strength development. Possesses good...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Ancamine® 2442
Evonik
Ancamine® 2442 is a modified polyamine crosslinker by Evonik. Used in potting compounds. Offers very good reactivity. Provides improved green strength development. Possesses good formulation shelf...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
CUREZOL® 2MA-OK
Evonik
CUREZOL® 2MA-OK by Evonik acts as an accelerator. Offers single package latency from several hours to greater than six months. It also functions as an accelerator in the reaction between epoxy...
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Applications
Epoxy, Epoxide Resin
Electronics / Computers
Electrical markets
Laminating
...
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