Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient... view more

Tetra-bromo bisphenol A based epoxy resin (80% solid) in MEK (methyl ethyl ketone). It acts as a fire retardant offering excellent fire retardancy. Applications include electric laminates... view more

Tetra-bromo bisphenol A based epoxy resin (75% solid) in MEK (methyl ethyl ketone). It acts as a fire retardant offering excellent fire retardancy. Applications include electric laminates... view more

Epoxy resin based on tetra-bromo bisphenol A (BPA). It acts as a fire retardant offering excellent fire retardancy. Suitable for molding materials including liquid molding compounds. Applications... view more

Epoxy resin based on tetra-bromo bisphenol A (BPA). It acts as a fire retardant offering excellent fire retardancy. Suitable for molding materials including liquid molding compounds. Applications... view more

Tetra-bromo bisphenol A based epoxy resin (60% solid) in MEK (methyl ethyl ketone). It acts as a fire retardant offering excellent fire retardancy. Applications include electric laminates... view more

Silicone based liquid mold release and parting agent. Offers very good release characteristics for simple and complex potting, casting, and molding operations. Recommended for releasing epoxy... view more

Ancamide® 910 is a versatile and flexible hardener by Evonik. Used for electronic potting and encapsulation compounds. Offers very good flexibility/peel strength. Provides very good thermal shock... view more

Ancamine® 1482 by Evonik acts as a curing agent for liquid epoxy resins. Exhibits excellent chemical and heat resistance. Provides long pot life and can be mixed at room temperature. Ancamine® 1482... view more

Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides... view more

Ancamine® 2014FG by Evonik is a latent curing agent based on a modified polyamine. It is used as an accelerator for dicyandiamide (DICY). It is a fine-grind version of Ancamine® 2014AS curing agent... view more

Ancamine® 2337S by Evonik is a modified aliphatic amine, a latent curing agent for epoxy resins. It offers very rapid reactivity, rapid green strength development and excellent shelf stability in... view more