BYK®-C 8013 by BYK is a solvent-free polymeric coupling agent to increase the mechanical strength of carbon fiber-reinforced and radical-curing systems. The additive results in improved mechanical... view more

BYK®-P 9060 by BYK is a processing additive for low-shrink SMC and BMC/DMC with mold release properties. It is a combination of surface-active substances and polymers. It stabilizes the compound and... view more

BYK®-P 9065 by BYK is a processing additive for low-shrink SMC and BMC/DMC with mold release properties. It is a combination of surface-active substances and polymers. The zinc stearate that is... view more

BYK®-P 9080 by BYK is a processing additive for low-profile and class A SMC systems with mold release properties. It is a combination of surface-active substances and polymers. It stabilizes the... view more

BYK®-P 9085 by BYK is a processing additive with mold-release and surface-enhancing properties for low profile & Class A SMC. It is a combination of surface-active substances and polymers. It... view more

BYK®-W 9010 by BYK is a solvent-free wetting and dispersing additive for filled, unsaturated polyester systems and epoxy systems. It is used to wet inorganic fillers (and inorganic pigments) in... view more

BYK®-W 9011 by BYK is a solvent-free wetting and dispersion additive for SMC, BMC and pultrusion to reduce the viscosity of fillers & pigments in LP and LS systems as well as in highly filled epoxy... view more

BYK®-W 9012 by BYK is a solvent-free, wetting and dispersing additive for closed mold applications to reduce the viscosity and improve the homogeneity of ATH-filled compounds. It improves the... view more

BYK®-W 972 by BYK is a wetting and dispersing additive for SMC/BMC and pultrusion to homogenize and stabilize the system and to increase the color homogeneity in molding compounds. It offers... view more