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Product Name
Supplier
Description
CarboTherm™ CTS
20
M
Ceramic Materials (Saint-Gobain Group)
Boron nitride. CarboTherm™ CTS
20
M by Ceramic Materials (Saint-Gobain Group) acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm™ CTS
20
M provides high thermal...
view more
Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting
...
CarboTherm™ CTS
25
M
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® CTS25M provides high thermal conductivity, excellent...
view more
Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting
...
CarboTherm™ CTS
2
M
Ceramic Materials (Saint-Gobain Group)
CarboTherm™ CTS
2
M by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm™ CTS
2
M provides high thermal...
view more
Applications
Other Thermoset
Electronics / Computers>Printed circuit boards
Electronics / Computers>Housings
Injection molding - thermoplastics
...
CarboTherm™ CTS
7
M
Ceramic Materials (Saint-Gobain Group)
CarboTherm™ CTS
7
M by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. It provides high thermal conductivity...
view more
Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics
...
CarboTherm™ PCTH
10
MHF
Ceramic Materials (Saint-Gobain Group)
CarboTherm™ PCTH
10
MHF by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic...
view more
Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics
...
CarboTherm™ PCTH
3
MHF
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® PCTH3MHF...
view more
Applications
Other Thermoset
Electronics / Computers>Printed circuit boards
Electronics / Computers>Housings
Conversion of composites & thermosets>Potting
...
CarboTherm™ PCTH
7
MHF
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® PCTH7MHF...
view more
Applications
Other Thermoset
Electronics / Computers>Printed circuit boards
Electronics / Computers>Housings
Conversion of composites & thermosets>Potting
...
CarboTherm™ PCTL
20
MHF
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient...
view more
Applications
Other Thermoset
Electronics / Computers>Printed circuit boards
Electronics / Computers>Housings
Conversion of composites & thermosets>Potting
...
CarboTherm™ PCTL
30
MHF
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient...
view more
Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Conversion of composites & thermosets>Potting
...
CarboTherm™ PCTL
7
MHF
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient...
view more
Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics
...
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