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Product Name
Supplier
Description
BRUGGOLEN® H3386
Brüggemann
BRUGGOLEN® H3386 by Brüggemann is a mixture of copper complex based antioxidants and synergists. Acts as a heat stabilizer. Provides very little discoloration upon thermal aging, excellent long term...
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Applications
PA, Nylon
Electrical markets
Electronics / Computers
Extrusion
...
2
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BRUGGOLEN® H3350
Brüggemann
BRUGGOLEN® H3350 by Brüggemann is a mixture of antioxidants based on copper complexes and synergists in pure. Acts as a heat stabilizer especially for unreinforced and reinforced polyamides...
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Applications
PA, Nylon
Electrical markets
Electronics / Computers
Dry blending/ Grinding
...
2
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BRUGGOLEN® H3376
Brüggemann
BRUGGOLEN® H3376 by Brüggemann is a synergistic composition of copper complexes and halogen compounds. Acts as a heat stabilizer and antioxidant. Provides long-term stabilization against fatigue of...
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Applications
PA, Nylon
Electrical markets
Electronics / Computers
Injection molding - thermoplastics
...
2
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Omya Smartfill®
Omya
Omya Smartfill® by Omya is a natural calcium carbonate with special surface modification. Exhibits excellent compatibility with engineering polymers such as polyamides (PA) and polycarbonate (PC)...
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Applications
Bioplastic>PHA
Bioplastic>PHB
Bioplastic>PLA
Bioplastic>PA11
...
3
Documents
Contact
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3M™ Boron Nitride Cooling Filler Agglomerates CFA 100
3M
3M™ Boron Nitride Cooling Filler Agglomerates CFA 100 by 3M is randomly oriented agglomerates for high filler loadings and isotropic thermal conductivity. Its softness helps facilitate low impact on...
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Applications
Other Thermoset
TPE and TPV
Electrical markets>Electrical components
Electronics / Computers>Electronic components
...
3M™ Boron Nitride Cooling Filler Agglomerates CFA 150
3M
3M™ Boron Nitride Cooling Filler Agglomerates CFA 150 by 3M is soft agglomerates for high filler loadings and isotropic thermal conductivity. It helps facilitate low impact on viscosity and easy...
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Applications
Other Thermoset
TPE and TPV
Automotive/ Transportation
Electronics / Computers>Electronic components
...
3M™ Boron Nitride Cooling Filler Agglomerates CFA 250S
3M
3M™ Boron Nitride Cooling Filler Agglomerates CFA 250SS by 3M is boron nitride platelets spray-dried with inorganic binder to spherical granulates for high flowability and dosing velocities during...
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Applications
TPE and TPV
Other Thermoset
Electrical markets>Electrical components
Electronics / Computers>Electronic components
...
3M™ Boron Nitride Cooling Filler Agglomerates CFA 50M
3M
3M™ Boron Nitride Cooling Filler Agglomerates CFA 50M by 3M is a mixture of agglomerates, platelets and boron nitride clusters. It provides excellent heat transfer capabilities (through-plane), high...
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Applications
TPE and TPV
Other Thermoset
Electronics / Computers>Electronic components
Automotive/ Transportation
...
3M™ Boron Nitride Cooling Filler Granulated Platelets CFP 012P
3M
3M™ Boron Nitride Cooling Filler Granulated Platelets CFP 012P by 3M is boron nitride platelets spray-dried with organic binder for excellent processability, flowability and high dosing velocities...
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Applications
Other Thermoset
TPE and TPV
Electrical markets>Electrical components
Electronics / Computers>Electronic components
...
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Licomont® NaV 101
Clariant
Licomont® NaV 101 by Clariant is sodium salt of long-chain aliphatic carboxylic acid. Acts as a lubricant and nucleating agent. Offers high molecular weight, low volatility, favourable migration...
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Applications
Other Thermoplastic>POM (Polyacetal)
PBT
PA, Nylon
PET
...
PARALOID™ EXL-2335 Impact Modifier
Dow
Paraloid™ EXL-2335 by Dow Corning is an acrylic core-shell impact modifier. Offers good colorability, and thermal stability along with excellent impact performance in a variety of engineering...
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PARALOID™ EXL-2691
Dow
(Methacrylate-Butadiene-Styrene) MBS Polymer. Used as impact modifier for automotive parts such as bumpers, body panels and interior parts, appliances such as blender housings, housings for...
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Applications
ABS
Other Thermoplastic>Other Polyester
PBT
Electronics / Computers>Housings
...
BORONID® S1-SF
ESK
BORONID® S1-SF by ESK is boron nitride. It is a colorless white, deagglomerated powder of crystalline high purity hBN. It is physiologically inert and has high thermal conductivity, low dielectric...
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Applications
Electronics / Computers
Extrusion
Compoundings
Injection molding - thermoplastics
...
BORONID® S12
ESK
Boron nitride. It is a colorless – white, deagglomerated powder of crystalline high purity hBN. BORONID® S12 is physiologically inert and has high thermal conductivity, low dielectric constant, high...
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Applications
Electronics / Computers
Injection molding - thermoplastics
Compoundings
Extrusion
...
ENSACO® 250 G
Imerys
ENSACO® 250 G by Imerys is a conductive carbon black-based filler. It has a low surface area & high structure and is available in the form of granules as well as powder. It enables resistance to...
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Applications
Other Rubber>NBR
PE>HDPE
PE>LDPE
PC
...
ENSACO® 260 G
Imerys
ENSACO® 260 G by Imerys is a conductive carbon black-based filler. It has a low surface area & high structure and is available in the form of granules. It enables very good conductivity & purity...
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Applications
PE>HDPE
Engineering / manufacturing>Belts, conveyors
Buildings & constructions>Flooring
Electrical markets>Switches
...
ENSACO® 350 G
Imerys
ENSACO® 350 G by Imerys is a conductive carbon black. It has a low surface area & high structure and is available in the form of granules. It enables resistance to shear, excellent conductivity...
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Applications
PE>HDPE
Other Rubber
PC
Electronics / Computers>Electronic components
...
CoolFX™ CFX-1020
Momentive Performance Materials
CoolFX™ CFX-1020 by Momentive Performance Materials is a boron nitride powder. It acts as a hybrid filler. It is used to enhance thermal conductivity while providing electrical isolation in...
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Applications
PA, Nylon
Automotive/ Transportation>Under the hood>Cooling water tanks
Aerospace/ Aircrafts
Electronics / Computers
...
CoolFX™ CFX-1021
Momentive Performance Materials
CoolFX™ CFX-1021 by Momentive Performance Materials is a boron nitride powder that acts as a hybrid filler. Used to enhance thermal conductivity while providing electrical isolation in thermoplastics. Offers better physical...
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Applications
Other Thermoplastic
Electronics / Computers
Automotive/ Transportation>Under the hood>Cooling water tanks
Aerospace/ Aircrafts
...
CoolFX™ CFX-1022
Momentive Performance Materials
CoolFX™ CFX-1022 by Momentive Performance Materials is boron nitride powder which acts as a hybrid filler. Used to enhance thermal conductivity while providing electrical isolation in thermoplastics. Offers better physical...
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Applications
Other Thermoplastic
Automotive/ Transportation>Under the hood>Cooling water tanks
Aerospace/ Aircrafts
Electronics / Computers
...
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