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HI-COOL TCF BNF 30
Carl Spaeter
HI-COOL TCF BNF 30 by Carl Spaeter is a hexagonal boron nitride-based thermally conductive filler. It offers excellent heat dissipation, low thermal expansion coefficient compared to mineral fillers, high...
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Applications
Epoxy, Epoxide Resin
Electrical markets>Housings
Electronics / Computers
Injection molding - thermoplastics
FRJ-425
SI Group
FRJ-425 by SI Group is a hardener for epoxy molding compounds for electronic applications. It is a novolak resin available in flake form. It is nearly colorless to light yellow color...
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Applications
Epoxy, Epoxide Resin
Electronics / Computers
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