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The material selection platform
Polymer Additives
The material selection platform
Polymer Additives
by SpecialChem
 
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23 products match your search
Product Name
Supplier
Description
Ancamine® 1110 by Evonik is dimethylaminomethylphenol-based catalyst. Designed for anhydride cures in castings and laminates and epoxy/polysulfide... view more
Ancamine® 1482 by Evonik acts as a curing agent for liquid epoxy resins. Exhibits excellent chemical and heat resistance. Provides long pot life and can be mixed at room temperature. Ancamine® 1482... view more
Ancamine® 1608 by Evonik is a modified aliphatic polyamine adduct based curing agent designed for for epoxy resin. Provides excellent chemical resistance against trichloroethane, xylene, water... view more
Ancamine® 1637-LV by Evonik is a rapid curing agent used in laminates. It is non-corrosive with rapid cure speed. Ancamine® 1637-LV offers very good resistance to solvents, inorganic acids and... view more
Ancamine® 1768 is a rapid ambient or low temperature curing agent by Evonik. Used as an accelerator for other amine-based curing agents and crack injection. Possesses fast cure at ambient and low... view more
Ancamine® 1769 by Evonik is a hydroxyalkylated polyamine curing agent. Used in electrical pottings and castings, wet lay-up laminating and tooling. It is DOT non-corrosive and offers good mechanical... view more
Ancamine® 1784 is a modified aliphatic amine curing agent by Evonik. Used in castings and laminates. Offers long pot life and good impact resistance... view more
Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides... view more
Ancamine® 2071 by Evonik is a rapid setting, phenol-free, epoxy curing agent and modifier. It also functions as an accelerator for other amine-based curing agents. Offers very fast property... view more
Ancamine® 2205 by Evonik is a phenol-free, curing agent. It is an accelerated modified aliphatic amine curative intended for use with liquid epoxy resins in two-part ambient or low-temperature cure... view more
Ancamine® 2264 by Evonik is epoxy curing agent. It exhibits some of the beneficial properties of both cycloaliphatic and aromatic amines. It is an ideal alternative to aromatic diamines in the... view more
Ancamine® 2390 by Evonik is a low-viscosity modified amine curing agent designed for liquid epoxy resin. It yields formulations with high elongation, strength, and hardness. It offers one-to-one mix... view more
Ancamine® 2450 is a cycloaliphatic amine crosslinker by Evonik. Used in filament winding, wet lay-up laminating and potting compounds. Offers higher glass transition temperature. Possesses low... view more
Ancamine® K54 by Evonik is a crosslinker based on 2,4,6-tris (dimethylaminomethyl) phenol. It is an efficient tertiary amine activator for epoxy resins cured with a wide variety of hardener types... view more
Ancamine® T by Evonik is a crosslinking agent based on N-(2-hydroxy ethyl)diethylene triamine. Acts as an ambient or elevated temperature curing agent for use with liquid epoxy resins. Possesses... view more
Ancamine® Z curing agent is a curing agent by Evonik. Offers very good chemical resistance. Designed for electrical and electronic encapsulation, tooling, laminates and composites, filament wound... view more
Ancamine® 1483 by Evonik is a crosslinking agent. It is an aliphatic amine adduct for room temperature curing of liquid epoxy resins. It offers fast cure speed, rigidity and high physical strength... view more
Ancamine® 2021 by Evonik is a room temperature curing agent for liquid epoxy resin. It is a modified aliphatic polyamine adduct. It offers long pot life, low viscosity, light color and low loading... view more
Ancamine® 2049 by Evonik is a curing agent based on unmodified cycloaliphatic amine used to cure epoxy resins at elevated temperatures. It is designed for use in large composite structural parts... view more
Ancamine® 2683 by Evonik is a cycloaliphatic amine-based curing agent recommended for heat-cured composite applications. It exhibits low viscosity, good thermal resistance and a high glass... view more
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