Aminoethylethanolamine (AEEA) by Dow is an epoxy curing agent, chelating agent and surfactant. It is a building block in the manufacture of specialty corrosion inhibitors. It is a single-component... view more

1-piperazineethaneamine. Used as an epoxy curing agent, and a mineral processing aid... view more

Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive... view more

DOWSIL™ EP-2601 Powder by Dow is a stress relief agent for epoxy molding compound. This epoxy functional elastomeric silicone powder is used in epoxy filled themoset composites. DOWSIL™ EP2601... view more

Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive... view more

Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive... view more

Epoxy and polyether modified dimethylsiloxane. It can be used as a component of EMC (electromagnetic compatibility) for stress relief and flowability... view more

Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive... view more

Aminoethylaminopropyltrimethoxysilane, 50% active in n-butanol/methanol. Adhesion promoter... view more

Hydrolyzed version of Xiameter® OFS-6032, 37% solids in solvents. Glass fiber treatment for composites, e.g. epoxy based print circuit board... view more

Aminoethylaminopropylsilane triol homopolymer in water, 22% actives. Improves adhesion to inorganic material, like glass (alternative to Xiameter® OFS-6020)... view more

Coupling agent for epoxy resins on glass fabrics in printed circuit board composites... view more

Phenylaminopropyl trimethoxysilane. Can be used in EMC formulation to improves adhesion between metal and EMC... view more

Complex mixture of linear, branched, and cyclic ethyleneamines. Used as epoxy curing agent... view more

Acrylic polymer. Used as an impact modifier for automotive under-the-hood applications, electric and electronic connectors, body panels for lawn mowers and tractors, and thermoset molding compounds... view more

PARALOID™ EXL-2655 by Dow is MBS core-shell impact modifier. It is designed to improve fatigue and impact resistance for thermosetting plastics, such as epoxy molding compounds. Possess excellent... view more

Cyclic member of the ethyleneamines family. Used as epoxy curing agent... view more

Mixture of three ethyleneamines. Used as epoxy curing agent... view more

Mixture of four different pentamines and additional higher and lower molecular weight ethyleneamines. Used as epoxy curing agent... view more

XIAMETER™ ACP-0100 Antifoam Compound by Dow is a high efficiency antifoaming agent and defoamer. This 100% active silicone antifoam compound is stable and effective over wide pH range (pH 1–14). It... view more