Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive... view more

DOWSIL™ EP-2601 Powder by Dow is a stress relief agent for epoxy molding compound. This epoxy functional elastomeric silicone powder is used in epoxy filled themoset composites. DOWSIL™ EP2601... view more

Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive... view more

Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive... view more

Epoxy and polyether modified dimethylsiloxane. It can be used as a component of EMC (electromagnetic compatibility) for stress relief and flowability... view more

Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive... view more

Aminoethylaminopropyltrimethoxysilane, 50% active in n-butanol/methanol. Adhesion promoter... view more

Hydrolyzed version of Xiameter® OFS-6032, 37% solids in solvents. Glass fiber treatment for composites, e.g. epoxy based print circuit board... view more

Aminoethylaminopropylsilane triol homopolymer in water, 22% actives. Improves adhesion to inorganic material, like glass (alternative to Xiameter® OFS-6020)... view more

Coupling agent for epoxy resins on glass fabrics in printed circuit board composites... view more

Phenylaminopropyl trimethoxysilane. Can be used in EMC formulation to improves adhesion between metal and EMC... view more