3,3',4,4'-Benzophenonetetracarboxylic dianhydride by Evonik acts as a crosslinker. Suggested for polymerization reactions. Compatible with polyimide and epoxy resins. 3,3',4,4'-Benzophenonetetracarboxylic dianhydride complies with REACH regulation... view more

AEROSIL® R 202 by Evonik acts as a thickening and thixotropic agent of cable gels for fiber optic cables. It improves flowability of powders and enables achieving of a high tribo-charge... view more

Dynasylan® HYDROSIL 1151 by Evonik acts as an adhesion promoter. Suggested for inorganic materials including glass, metals and fibers as well as organic polymers including thermosets, thermoplastics... view more

Dynasylan® HYDROSIL 1153 is an adhesion promoter by Evonik. Suitable for mineral filled composites, foundry resins like cold curing phenolic and furane resins. Suggested for inorganic materials... view more

TEGOMER® A-Si 2322 by Evonik is an amino-functional polysiloxane-based reactive bulk modifier. It exhibits improved molding flow, tack-free properties by release effect and improved flexibility... view more

VESTASOL® IP eCO by Evonik is a high-boiling solvent for vinyl chloride-vinyl acetate copolymers, polyacrylates or alkyd resins. It is also an excellent leveling agent for polyesters, polyacrylates and... view more