Bentone® 38 by Elementis is an organic derivative of a hectorite clay. It acts as a highly efficient rheological additive, designed for low to intermediate polarity organic systems. It aids in... view more

Eustab FR-2500 by Eutec Chemical is an oligomeric phosphorus-containing non-halogen flame retardant with high phosphorus content, moderate melting points and good processing properties. Has high initial... view more

An oligomeric phosphorus-containing non-halogen flame retardant with high phosphorus content, moderate melting points and good processing properties. Has high initial decomposition temperature... view more

AP 1210 by Everkem is a decabromodiphenyl oxide grade. Acts as a flame retardant. Applications include PP (polypropylene), PE (polyethylene), TPO (thermoplastic olefin), ABS (acrylonitrile... view more

AP 1210 S by Everkem is a decabromodiphenyl oxide grade. Acts as a flame retardant. Applications include PP (polypropylene), PE (polyethylene), TPO (thermoplastic olefin), ABS (acrylonitrile... view more

AP 1210 XF by Everkem is a decabromodiphenyl oxide grade. Acts as a flame retardant. Applications include PP (polypropylene), PE (polyethylene), TPO (thermoplastic olefin), ABS (acrylonitrile... view more

AP 2930 by Everkem is an ethylenebistetrabromophthalimide grade. Acts as a flame retardant. Applications include PP(polypropylene), PE(polyethylene), PVC(polyvinylchloride), HIPS(high impact... view more

AP 810 by Everkem is a decabromodiphenyl ethane grade. Acts as a flame retardant. Applications include PP(polypropylene), PE(polyethylene), TPO(thermoplastic olefin), ABS(acrylonitrile... view more

3,3',4,4'-Benzophenonetetracarboxylic dianhydride by Evonik acts as a crosslinker. Suggested for polymerization reactions. Compatible with polyimide and epoxy resins. 3,3',4,4'-Benzophenonetetracarboxylic dianhydride complies with REACH regulation... view more

AEROSIL® R 202 by Evonik acts as a thickening and thixotropic agent of cable gels for fiber optic cables. It improves flowability of powders and enables achieving of a high tribo-charge... view more

Dynasylan® HYDROSIL 1151 by Evonik acts as an adhesion promoter. Suggested for inorganic materials including glass, metals and fibers as well as organic polymers including thermosets, thermoplastics... view more

Dynasylan® HYDROSIL 1153 is an adhesion promoter by Evonik. Suitable for mineral filled composites, foundry resins like cold curing phenolic and furane resins. Suggested for inorganic materials... view more

TEGOMER® A-Si 2322 by Evonik is an amino-functional polysiloxane-based reactive bulk modifier. It exhibits improved molding flow, tack-free properties by release effect and improved flexibility... view more

Antimicrobial additive based on silver-functionalized clay. It prevents the growth of bacteria, mold, fungus and other microorganisms which act as a powerful tool against odors and stains. It is... view more