Ancamide® 2443 by Evonik is a low viscosity, plasticizer-free epoxy curing agent and modifier by Evonik. It enables the development of high-performance formulations that can be applied via... view more

Ancamide® 260A by Evonik acts as a curing agent. It is a standard reactive liquid polyamide for casting and laminates. Offers good chemical resistance. Ancamide® 260A shows compatability with a wide range... view more

Dynasylan® HYDROSIL 1151 by Evonik acts as an adhesion promoter. Suggested for inorganic materials including glass, metals and fibers as well as organic polymers including thermosets, thermoplastics... view more

Dynasylan® HYDROSIL 1153 is an adhesion promoter by Evonik. Suitable for mineral filled composites, foundry resins like cold curing phenolic and furane resins. Suggested for inorganic materials... view more

TEGOMER® A-Si 2322 by Evonik is an amino-functional polysiloxane-based reactive bulk modifier. It exhibits improved molding flow, tack-free properties by release effect and improved flexibility... view more

VESTAMIN® IPD eCO by Evonik is a low viscosity hardener based on cycloaliphatic diamine, with a faint amine odor. It shows low tendency to form carbamates, and humidity resistance.It exhibits excellent... view more