Epoxy functional silicone resin. It can be used in EMC (electromagnetic compatibility) applications to impart flexibility, stress relief and flame retardancy. Improves adhesion on metals... view more

Aminoethylaminopropyltrimethoxysilane, 50% active in n-butanol/methanol. Adhesion promoter... view more

Hydrolyzed version of Xiameter® OFS-6032, 37% solids in solvents. Glass fiber treatment for composites, e.g. epoxy based print circuit board... view more

Aminoethylaminopropylsilane triol homopolymer in water, 22% actives. Improves adhesion to inorganic material, like glass (alternative to Xiameter® OFS-6020)... view more

Coupling agent for epoxy resins on glass fabrics in printed circuit board composites... view more

Methyldimethoxysilane, reactive silane containing both Si-H and methoxy functional groups. The SiH group can be utilized for hydrosilylation to form methoxysilyl functional materials. Modification... view more

Phenylaminopropyl trimethoxysilane. Can be used in EMC formulation to improves adhesion between metal and EMC... view more