Amicure® 101 by Evonik acts as an amine curing agent. Used in fiberglass/epoxy filament, encapsulate stator and ignition coils, passive components and general-purpose electrical devices. Offers very... view more

Ancamide® 350A by Evonik is a standard reactive liquid polyamide curing agent for epoxy resins. It is suitable for encapsulation and castings. It provides low viscosity, higher imidazoline content and... view more

Ancamide® 910 is a versatile and flexible hardener by Evonik. Used for electronic potting and encapsulation compounds. Offers very good flexibility/peel strength. Provides very good thermal shock... view more

Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides... view more

Ancamine® K61B is tris-(dimethyla-minomethyl) phenol tri(2-ethyl hexoate) based crosslinking agent by Evonik. Used in electrical castings, potting, encapsulation and wet lay-up laminate systems... view more

Ancamine® T by Evonik is a crosslinking agent based on N-(2-hydroxy ethyl)diethylene triamine. Acts as an ambient or elevated temperature curing agent for use with liquid epoxy resins. Possesses... view more

Ancamine® TEPA by Evonik acts as a crosslinking agent. It is a standard commercial grade of tetraethylene pentamine. It is less corrosive and has a lower vapor pressure and is also less hygroscopic... view more

CUREZOL® 1B2MZ by Evonik is imidazole curing agent for epoxy resins. It is a low viscosity accelerator. Designed for potting and encapsulation in electrical and electronic applications. CUREZOL®... view more

CUREZOL® 2E4MZ by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Possesses rapid... view more

Epodil® 749 by Evonik is a reactive difunctional reactive diluent based on neopentyl glycol. It can be added in small quantities (less than 5%) to standard epoxy resins. Offers resistance to... view more

Epodil® 750 is a difunctional reactive diluent by Evonik. Used to reduce the viscosity of epoxy resin systems. It helps obtain maximum viscosity reduction with physical and performance properties... view more

Imicure® AMI-1 by Evonik is a liquid, elevated-temperature, catalytic curing agent for epoxy resins. Used in pre-preg composites and encapsulation. Imicure® AMI-1 is used at low loadings of 1-5 phr... view more

Ancamine® 2709 by Evonik is a curing agent. It is a tertiary amine based cure accelerator. It imparts rapid cure at elevated temperatures. It is designed for dicyandiamide and anhydride cured epoxy... view more

Ancamine® DETA by Evonik is 98.5% minimum purity grade of diethylenetriamine-based unmodified curing agent in encapsulation. It has a strong tendency for carbanation. It is used in the modification... view more