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Supplier
Description
CarboTherm™ PCTL
7
MHF
Ceramic Materials (Saint-Gobain Group)
Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient...
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Applications
Other Thermoset
Electronics / Computers>Housings
Electronics / Computers>Printed circuit boards
Injection molding - thermoplastics
...
EPICLON® 1121N-80M
DIC Corporation
Tetra-bromo bisphenol A based epoxy resin (80% solid) in MEK (methyl ethyl ketone). It acts as a fire retardant offering excellent fire retardancy. Applications include electric laminates...
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Applications
Electrical markets
Conversion of composites & thermosets>Powder coatings
Laminating
Conversion of composites & thermosets>Potting
...
EPICLON® 1123P-75M
DIC Corporation
Tetra-bromo bisphenol A based epoxy resin (75% solid) in MEK (methyl ethyl ketone). It acts as a fire retardant offering excellent fire retardancy. Applications include electric laminates...
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Applications
Electrical markets
Conversion of composites & thermosets>Potting
Laminating
Conversion of composites & thermosets>Powder coatings
...
EPICLON® 152
DIC Corporation
Epoxy resin based on tetra-bromo bisphenol A (BPA). It acts as a fire retardant offering excellent fire retardancy. Suitable for molding materials including liquid molding compounds. Applications...
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Applications
Conversion of composites & thermosets>Potting
Laminating
Conversion of composites & thermosets>Powder coatings
Safety, regulation & environment>Flame retardancy
EPICLON® 153
DIC Corporation
Epoxy resin based on tetra-bromo bisphenol A (BPA). It acts as a fire retardant offering excellent fire retardancy. Suitable for molding materials including liquid molding compounds. Applications...
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Applications
Conversion of composites & thermosets>Powder coatings
Laminating
Conversion of composites & thermosets>Potting
Safety, regulation & environment>Flame retardancy
EPICLON® 153-60M
DIC Corporation
Tetra-bromo bisphenol A based epoxy resin (60% solid) in MEK (methyl ethyl ketone). It acts as a fire retardant offering excellent fire retardancy. Applications include electric laminates...
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Applications
Electrical markets
Conversion of composites & thermosets>Potting
Laminating
Conversion of composites & thermosets>Powder coatings
...
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products matching your search
Conap® MR-5002 Discontinued
ELANTAS (Altana Group)
Silicone based liquid mold release and parting agent. Offers very good release characteristics for simple and complex potting, casting, and molding operations. Recommended for releasing epoxy...
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Applications
Epoxy, Epoxide Resin
PUR
Conversion of composites & thermosets>Potting
Extrusion>Films (cast)
Ancamide® 910
Evonik
Ancamide® 910 is a versatile and flexible hardener by Evonik. Used for electronic potting and encapsulation compounds. Offers very good flexibility/peel strength. Provides very good thermal shock...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® 1482
Evonik
Ancamine® 1482 by Evonik acts as a curing agent for liquid epoxy resins. Exhibits excellent chemical and heat resistance. Provides long pot life and can be mixed at room temperature. Ancamine® 1482...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Filament winding1
Laminating
Conversion of composites & thermosets>Potting
Ancamine® 1922A
Evonik
Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® 2014FG
Evonik
Ancamine® 2014FG by Evonik is a latent curing agent based on a modified polyamine. It is used as an accelerator for dicyandiamide (DICY). It is a fine-grind version of Ancamine® 2014AS curing agent...
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Applications
Conversion of composites & thermosets>Potting
Polymer surface adhesion>Adhesion to substrates
Ancamine® 2337S
Evonik
Ancamine® 2337S by Evonik is a modified aliphatic amine, a latent curing agent for epoxy resins. It offers very rapid reactivity, rapid green strength development and excellent shelf stability in...
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Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Polymer Conversion>Dispersion
Polymer surface adhesion>Adhesion to substrates
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