Ancamide® 910 is a versatile and flexible hardener by Evonik. Used for electronic potting and encapsulation compounds. Offers very good flexibility/peel strength. Provides very good thermal shock... view more

Ancamine® 1482 by Evonik acts as a curing agent for liquid epoxy resins. Exhibits excellent chemical and heat resistance. Provides long pot life and can be mixed at room temperature. Ancamine® 1482... view more

Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides... view more

Ancamine® 2014FG by Evonik is a latent curing agent based on a modified polyamine. It is used as an accelerator for dicyandiamide (DICY). It is a fine-grind version of Ancamine® 2014AS curing agent... view more

Ancamine® 2337S by Evonik is a modified aliphatic amine, a latent curing agent for epoxy resins. It offers very rapid reactivity, rapid green strength development and excellent shelf stability in... view more

Ancamine® 2441 by Evonik is a modified polyamine-based crosslinking agent. Used in potting compounds. Offers very good reactivity. Provides improved green strength development. Possesses good... view more

Ancamine® 2442 is a modified polyamine crosslinker by Evonik. Used in potting compounds. Offers very good reactivity. Provides improved green strength development. Possesses good formulation shelf... view more

Ancamine® 2450 is a cycloaliphatic amine crosslinker by Evonik. Used in filament winding, wet lay-up laminating and potting compounds. Offers higher glass transition temperature. Possesses low... view more

Ancamine® K61B is tris-(dimethyla-minomethyl) phenol tri(2-ethyl hexoate) based crosslinking agent by Evonik. Used in electrical castings, potting, encapsulation and wet lay-up laminate systems... view more

Ancamine® T by Evonik is a crosslinking agent based on N-(2-hydroxy ethyl)diethylene triamine. Acts as an ambient or elevated temperature curing agent for use with liquid epoxy resins. Possesses... view more

CUREZOL® 1B2MZ by Evonik is imidazole curing agent for epoxy resins. It is a low viscosity accelerator. Designed for potting and encapsulation in electrical and electronic applications. CUREZOL®... view more

CUREZOL® 2E4MZ by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Possesses rapid... view more

CUREZOL® 2MA-OK by Evonik acts as an accelerator. Offers single package latency from several hours to greater than six months. It also functions as an accelerator in the reaction between epoxy... view more

CUREZOL® 2MZ Azine by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Exhibits rapid cure beyond activation temperatures. Suggested for casting, potting and... view more

CUREZOL® 2P4MZ by Evonik acts as an accelerator for dicyandiamide, anhydride and phenolic curing agents. Offers single package latency from several hours to greater than six months. Provides high... view more

CUREZOL® 2PHZ-S by Evonik is an accelerator for epoxy resins. Offers single package latency from several hours to greater than six months. Possesses rapid cure beyond activation temperatures. Provides... view more

CUREZOL® 2PZ is an accelerator by Evonik. Suitable for the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months... view more

CUREZOL® C17Z by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Exhibits rapid... view more

Dynasylan® A SQ by Evonik acts as a crosslinking agent. It is a suitable base material for the production of ultra-high purity tetraethoxysilane (UHP TEOS) used in the electronic industry. It is... view more

Epodil® 742 monofunctional reactive diluent by Evonik is cresyl glycidyl ether (CGE). Used to reduce the viscosity of epoxy resin systems. It causes molecular weight chain termination, and reduces... view more