ACH Si-EPY-187 by Achiewell is an organo-silane coupling agent with hydrolysable methoxy groups. It also contains a glycidoxy functional group that allows targeting resin matrixes such as epoxy, butyl... view more

Lapox® ARBZ-11 by Atul is bisphenol-A based difunctional and halogen free, benzoxazine thermoset resin. It acts as a heat stabilizer. Exhibits low shrinkage, excellent chemical and thermal... view more

Lapox® K-450 by Atul is a liquid aromatic amine curing agent with very low reactivity. When it is used with basic liquid resin (EEW: 190), it provides excellent combination of mechanical, electrical... view more

Used when maximum resistance to yellowing and premium optical and electrical performance are required... view more

Amicure® 101 by Evonik acts as an amine curing agent. Used in fiberglass/epoxy filament, encapsulate stator and ignition coils, passive components and general-purpose electrical devices. Offers very... view more

Ancamide® 350A by Evonik is a standard reactive liquid polyamide curing agent for epoxy resins. It is suitable for encapsulation and castings. It provides low viscosity, higher imidazoline content and... view more

Ancamide® 910 is a versatile and flexible hardener by Evonik. Used for electronic potting and encapsulation compounds. Offers very good flexibility/peel strength. Provides very good thermal shock... view more

Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides... view more

Ancamine® T by Evonik is a crosslinking agent based on N-(2-hydroxy ethyl)diethylene triamine. Acts as an ambient or elevated temperature curing agent for use with liquid epoxy resins. Possesses... view more