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Product Name
Supplier
Description
DOWSIL™ EP-2600 Powder
Dow
Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive...
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Applications
Epoxy, Epoxide Resin
DOWSIL™ EP-2601 Powder
Dow
DOWSIL™ EP-2601 Powder by Dow is a stress relief agent for epoxy molding compound. This epoxy functional elastomeric silicone powder is used in epoxy filled themoset composites. DOWSIL™ EP2601...
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Applications
Epoxy, Epoxide Resin
DOWSIL™ EP-5500 Powder
Dow
Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive...
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Applications
Epoxy, Epoxide Resin
DOWSIL™ EP-5518 Powder
Dow
Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive...
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Applications
Epoxy, Epoxide Resin
DOWSIL™ SF 8421 EG Fluid
Dow
Epoxy and polyether modified dimethylsiloxane. It can be used as a component of EMC (electromagnetic compatibility) for stress relief and flowability...
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Applications
Epoxy, Epoxide Resin
Polymer Conversion>Flow improvement
DOWSIL™ TREFIL E-606 Silicone Powder
Dow
Silicone elastomeric powder with spherical shape. Can be used in EMC formulation as stress relief additive...
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Applications
Epoxy, Epoxide Resin
DOWSIL™ Z-6121 Silane
Dow
Aminoethylaminopropyltrimethoxysilane, 50% active in n-butanol/methanol. Adhesion promoter...
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Applications
Epoxy, Epoxide Resin
Coatings
Curing & polymerisation control
Polymer surface adhesion>Adhesion to substrates
DOWSIL™ Z-6132 Silane
Dow
Hydrolyzed version of Xiameter® OFS-6032, 37% solids in solvents. Glass fiber treatment for composites, e.g. epoxy based print circuit board...
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Applications
Epoxy, Epoxide Resin
Electronics / Computers>Printed circuit boards
Polymer surface adhesion>Adhesion to substrates
DOWSIL™ Z-6137 Silane
Dow
Aminoethylaminopropylsilane triol homopolymer in water, 22% actives. Improves adhesion to inorganic material, like glass (alternative to Xiameter® OFS-6020)...
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Applications
Other Thermoset>P (or PF)
PUR
Epoxy, Epoxide Resin
Polymer surface adhesion>Adhesion to substrates
...
DOWSIL™ Z-6269 Silane
Dow
Coupling agent for epoxy resins on glass fabrics in printed circuit board composites...
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Applications
PP
Epoxy, Epoxide Resin
PE
Electronics / Computers>Printed circuit boards
...
DOWSIL™ Z-6883 Silane
Dow
Phenylaminopropyl trimethoxysilane. Can be used in EMC formulation to improves adhesion between metal and EMC...
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Applications
Epoxy, Epoxide Resin
Polymer surface adhesion>Adhesion to substrates
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