CarboTherm™ CTF₅ by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure... view more

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

CarboTherm™ CTP₁₆ by Ceramic Materials (Saint-Gobain Group) acts as a filler. It is boron nitride that offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure... view more

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to... view more

CarboTherm™ CTPO₅ by Ceramic Materials (Saint-Gobain Group) acts as a filler. It is boron nitride that offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure... view more

Boron nitride. CarboTherm™ CTS₂₀M by Ceramic Materials (Saint-Gobain Group) acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm™ CTS₂₀M provides high thermal... view more

Boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® CTS25M provides high thermal conductivity, excellent... view more

CarboTherm™ CTS₂M by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm™ CTS₂M provides high thermal... view more

CarboTherm™ CTS₇M by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. It provides high thermal conductivity... view more

CarboTherm™ PCT-UFB by Ceramic Materials (Saint-Gobain Group) acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and... view more

CarboTherm™ PCTH₁₀MHF by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic... view more

Boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® PCTH3MHF... view more

Boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® PCTH7MHF... view more

Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient... view more

Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient... view more

Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient... view more