Ancamide® 2781 by Evonik is a versatile, low viscosity hardener designed to cure epoxy resin at elevated temperatures. It provides longer working time and low exotherm. Ancamide® 2781 is recommended... view more

CUREZOL® 1B2MZ by Evonik is imidazole curing agent for epoxy resins. It is a low viscosity accelerator. Designed for potting and encapsulation in electrical and electronic applications. CUREZOL®... view more

CUREZOL® 2E4MZ by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Possesses rapid... view more

Dynasylan® A SQ by Evonik acts as a crosslinking agent. It is a suitable base material for the production of ultra-high purity tetraethoxysilane (UHP TEOS) used in the electronic industry. It is... view more

Dynasylan® HMDS by Evonik acts as an adhesion promoter in the microelectronic industry and hydrophobation agent for fillers. It blocks and protects hydroxylic groups. It is registered with EINCECS... view more

Imicure® EMI-24 by Evonik functions as both a curing agent and a cure accelerator for high-performance epoxy resin systems. Used in printed circuit board laminates, filament winding applications and... view more