1,7-Octadiene by Evonik acts as a crosslinker for polyolefins. Provides derivatization and polymerization in plastics. Suitable for use in pulp, paper & packaging, electronics and telecommunication... view more

ACCUREL® GA372 by Evonik is an amine or amide-free anti-static agent. It is based on LLDPE carrier resin. It can be incorporated by using gravimetric dosing equipment or by adding it to a dry blend... view more

Ancamide® 2781 by Evonik is a versatile, low viscosity hardener designed to cure epoxy resin at elevated temperatures. It provides longer working time and low exotherm. Ancamide® 2781 is recommended... view more

CUREZOL® 1B2MZ by Evonik is imidazole curing agent for epoxy resins. It is a low viscosity accelerator. Designed for potting and encapsulation in electrical and electronic applications. CUREZOL®... view more

CUREZOL® 2E4MZ by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Possesses rapid... view more

CUREZOL® 2MA-OK by Evonik acts as an accelerator. Offers single package latency from several hours to greater than six months. It also functions as an accelerator in the reaction between epoxy... view more

CUREZOL® 2MZ Azine by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Exhibits rapid cure beyond activation temperatures. Suggested for casting, potting and... view more

CUREZOL® 2P4MZ by Evonik acts as an accelerator for dicyandiamide, anhydride and phenolic curing agents. Offers single package latency from several hours to greater than six months. Provides high... view more

CUREZOL® 2PHZ-S by Evonik is an accelerator for epoxy resins. Offers single package latency from several hours to greater than six months. Possesses rapid cure beyond activation temperatures. Provides... view more

CUREZOL® 2PZ is an accelerator by Evonik. Suitable for the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months... view more

CUREZOL® C17Z by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Exhibits rapid... view more

Dynasylan® A SQ by Evonik acts as a crosslinking agent. It is a suitable base material for the production of ultra-high purity tetraethoxysilane (UHP TEOS) used in the electronic industry. It is... view more

Dynasylan® HMDS by Evonik acts as an adhesion promoter in the microelectronic industry and hydrophobation agent for fillers. It blocks and protects hydroxylic groups. It is registered with EINCECS... view more

Imicure® EMI-24 by Evonik functions as both a curing agent and a cure accelerator for high-performance epoxy resin systems. Used in printed circuit board laminates, filament winding applications and... view more

TEGOMER® AntiScratch 200 by Evonik is siloxane polyamide compound-based anti-scratch agent. It is a non- migrative additive for the improvement of permanent, long-term scratch resistance. It can be... view more