BRUGGOLEN® TP-H2018 by Brüggemann is a copper salt-based heat stabilizer. It is a masterbatch with a polyamide 6 carrier containing synergist at 4% total additive content. This product offers very... view more

Processing aid masterbatch. It effectively lowers the apparent viscosity of the polymer melt during processing which leads to reduced friction between the polymer melt and internal metal surfaces of... view more

Maleïc anhydride modified high density polyethylene based additive. Acts as a coupling agent or compatibilizer. Provides excellent mechanical properties, good cost to performance ratio, ultra low... view more

Maleic anhydride modified low density polyethylene based additive. Acts as a coupling agent or compatibilizer. Provides excellent mechanical properties, good cost to performance ratio, ultra low... view more

Chimassorb® 2020 by BASF is a high molecular weight hindered amine light stabilizer (HALS). Offers an optimal combination of exceptional levels of UV- and long-term thermal stability and ancillary... view more

Chimassorb® 944 FDL by BASF is a poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-piperidinyl)imino]-1,6 hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]])... view more

Irgastat® P 18 FCA by BASF is a polymeric system based on polyamide/polyether block amide. Acts as an anti-static agent. It is incorporated as melt additive. Irgastat® 18 FCAis non-sparking... view more

Irgastat® P 20 by BASF is a polymeric system based on polyamide/polyether block amide. Acts as an anti-static agent. It is incorporated as melt additive. It is non-sparking, transparent, thermally... view more

Irgastat® P 22 by BASF is a polymeric system based on polyamide/polyether block amide. Acts as an anti-static agent. It is incorporated as melt additive. Irgastat® P 22 is non-sparking, transparent... view more

BYK-MAX HS 4300 by BYK is a granulated carrier-free long-term thermal stabilizer for use in polyamide compounds. It provides a complete thermal stabilization system for polyamide fibers, films and... view more

SCONA® TPPP 8112 GA by BYK is an adhesion promoter and coupling agent for natural fiber compounds in polypropylene. In TPE-S overmolding compounds, it improves adhesion on hard substrates (such as... view more

SCONA® TSEB 2113 GB by BYK is a modifier for improved impact strength. It is used as a dispersing aid for fillers (ATH, Mg(OH)2) in polyethylene compounds. It is ethylene butyl acrylate copolymer... view more

Brominated polystyrene. Acts as a flame retardant. Provides outstanding thermal stability and electrical performance. It is particularly suitable for engineering plastic applications such as... view more