Boron nitride. It contains boric oxide binder system which absorbs moisture and causes swelling as well as property degradation. Has high thermal conductivity, low thermal expansion, good thermal... view more

Boron nitride. It contains calcium borate binder system which offers moisture resistance. Has high thermal conductivity, low thermal expansion, good thermal shock resistance, as well as high... view more

Boron nitride. It does not contain binders and has high thermal conductivity, low thermal expansion, good thermal shock resistance, as well as high electric resistance. Boron Nitride XP is... view more

REGAL® SRF by Cabot is a carbon black in the class known as Semi-Reinforcing Furnace (SRF) carbon blacks. It has a lower surface area than ASTM N500 and N600 carbon blacks and a structure lower than... view more

DBQDO® by LORD is Dibenzoyl Quinone Dioxime. Acts as a vulcanizing- and curing agent. Improves heat- and electrical resistance. It shows slow reactivity which allows longer processing time... view more

Quinone dioxime (90-100%wt). Acts as a non-sulfur vulcanizing- and curing agent. Improves heat, electrical resistance and heat-aging properties. It gets activated with red lead, benzothiazyl... view more