ACH Si-EPY-187 by Achiewell is an organo-silane coupling agent with hydrolysable methoxy groups. It also contains a glycidoxy functional group that allows targeting resin matrixes such as epoxy, butyl... view more

Lapox® ARBZ-11 by Atul is bisphenol-A based difunctional and halogen free, benzoxazine thermoset resin. It acts as a heat stabilizer. Exhibits low shrinkage, excellent chemical and thermal... view more

CUREZOL® 1B2MZ by Evonik is imidazole curing agent for epoxy resins. It is a low viscosity accelerator. Designed for potting and encapsulation in electrical and electronic applications. CUREZOL®... view more

CUREZOL® 2E4MZ by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Possesses rapid... view more

CUREZOL® 2MA-OK by Evonik acts as an accelerator. Offers single package latency from several hours to greater than six months. It also functions as an accelerator in the reaction between epoxy... view more

CUREZOL® 2MZ Azine by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Exhibits rapid cure beyond activation temperatures. Suggested for casting, potting and... view more

CUREZOL® 2P4MZ by Evonik acts as an accelerator for dicyandiamide, anhydride and phenolic curing agents. Offers single package latency from several hours to greater than six months. Provides high... view more