The material selection platform
Polymer Additives
OK
The material selection platform
Polymer Additives
Welcome back
,
My Profile
My Subscriptions
My Courses & Tutorials
Logout
Subscribe to Newsletters
Login / Register
The material selection platform
Polymer Additives
Additives Database
Selection Resources
News & Feeds
SEARCH
OK
Home
Search site
Product Search
by SpecialChem
Share
Feedback
Get link
Copy
Save
Cette page a bien été ajoutée à vos favoris
View all pages saved
CONTINUE BROWSING
Products (
857
)
Documents (
0
)
News (
53
)
REFINE YOUR SEARCH
(
active filters)
27
products match your search
Detailed
List
Product Name
Supplier
Description
AMICURE® 101
Evonik
Amicure® 101 by Evonik acts as an amine curing agent. Used in fiberglass/epoxy filament, encapsulate stator and ignition coils, passive components and general-purpose electrical devices. Offers very...
view more
Applications
Epoxy, Epoxide Resin
Electrical markets
Conversion of composites & thermosets>Encapsulating
Ancamide® 350A
Evonik
Ancamide® 350A by Evonik is a standard reactive liquid polyamide curing agent for epoxy resins. It is suitable for encapsulation and castings. It provides low viscosity, higher imidazoline content and...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Encapsulating
Ancamide® 910
Evonik
Ancamide® 910 is a versatile and flexible hardener by Evonik. Used for electronic potting and encapsulation compounds. Offers very good flexibility/peel strength. Provides very good thermal shock...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® 1482
Evonik
Ancamine® 1482 by Evonik acts as a curing agent for liquid epoxy resins. Exhibits excellent chemical and heat resistance. Provides long pot life and can be mixed at room temperature. Ancamine® 1482...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Filament winding1
Laminating
Conversion of composites & thermosets>Potting
Ancamine® 1922A
Evonik
Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® 2264
Evonik
Ancamine® 2264 by Evonik is epoxy curing agent. It exhibits some of the beneficial properties of both cycloaliphatic and aromatic amines. It is an ideal alternative to aromatic diamines in the...
view more
Applications
Epoxy, Epoxide Resin
Pipes, Hoses & Fittings
Conversion of composites & thermosets>Resin transfer Molding
Conversion of composites & thermosets>Filament winding1
Ancamine® 2450
Evonik
Ancamine® 2450 is a cycloaliphatic amine crosslinker by Evonik. Used in filament winding, wet lay-up laminating and potting compounds. Offers higher glass transition temperature. Possesses low...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Laminating
Conversion of composites & thermosets>Filament winding1
Ancamine® K61B
Evonik
Ancamine® K61B is tris-(dimethyla-minomethyl) phenol tri(2-ethyl hexoate) based crosslinking agent by Evonik. Used in electrical castings, potting, encapsulation and wet lay-up laminate systems...
view more
Applications
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® T
Evonik
Ancamine® T by Evonik is a crosslinking agent based on N-(2-hydroxy ethyl)diethylene triamine. Acts as an ambient or elevated temperature curing agent for use with liquid epoxy resins. Possesses...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Encapsulating
Conversion of composites & thermosets>Potting
Laminating
Ancamine® TEPA
Evonik
Ancamine® TEPA by Evonik acts as a crosslinking agent. It is a standard commercial grade of tetraethylene pentamine. It is less corrosive and has a lower vapor pressure and is also less hygroscopic...
view more
Applications
Conversion of composites & thermosets>Encapsulating
CUREZOL® 1B2MZ
Evonik
CUREZOL® 1B2MZ by Evonik is imidazole curing agent for epoxy resins. It is a low viscosity accelerator. Designed for potting and encapsulation in electrical and electronic applications. CUREZOL®...
view more
Applications
Epoxy, Epoxide Resin
Electronics / Computers
Electrical markets
Conversion of composites & thermosets>Potting
...
CUREZOL® 2E4MZ
Evonik
CUREZOL® 2E4MZ by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Possesses rapid...
view more
Applications
Epoxy, Epoxide Resin
Electronics / Computers
Electrical markets
Conversion of composites & thermosets>Encapsulating
...
Dynasylan® A SQ
Evonik
Dynasylan® A SQ by Evonik acts as a crosslinking agent. It is a suitable base material for the production of ultra-high purity tetraethoxysilane (UHP TEOS) used in the electronic industry. It is...
view more
Applications
Electronics / Computers
Conversion of composites & thermosets>Potting
Curing & polymerisation control>Crosslinking/ Hardening
Epodil® 742
Evonik
Epodil® 742 monofunctional reactive diluent by Evonik is cresyl glycidyl ether (CGE). Used to reduce the viscosity of epoxy resin systems. It causes molecular weight chain termination, and reduces...
view more
Applications
Epoxy, Epoxide Resin
Engineering / manufacturing>Tools & equipments
Conversion of composites & thermosets>Potting
Safety, regulation & environment>Low volatiles
...
Epodil® 746
Evonik
Epodil® 746 by Evonik is an aliphatic glycidyl ether, specifically 2-ethylhexyl glycidyl ether (EHGE). It is monofunctional and reduces the viscosity of epoxy resin systems. It causes molecular...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Laminating
Mechanical/ physical performance>Flexibility
...
Epodil® 747
Evonik
Epodil® 747 by Evonik is a monofunctional reactive diluent. It has low volatility and increased pot life. Offers efficient viscosity reduction in epoxy resin systems and improves flexibility...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Laminating
Mechanical/ physical performance>Flexibility
...
Epodil® 749
Evonik
Epodil® 749 by Evonik is a reactive difunctional reactive diluent based on neopentyl glycol. It can be added in small quantities (less than 5%) to standard epoxy resins. Offers resistance to...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Laminating
Epodil® 750
Evonik
Epodil® 750 is a difunctional reactive diluent by Evonik. Used to reduce the viscosity of epoxy resin systems. It helps obtain maximum viscosity reduction with physical and performance properties...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Laminating
...
Epodil® 757
Evonik
Epodil® 757 by Evonik is a reactive diluent. It is a technical grade of the glycidyl ether of cyclohexane dimethanol. Designed to reduce the viscosity of epoxy resin systems. Offers excellent creep...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Laminating
Mechanical/ physical performance>Creeping resistance
Epodil® 759
Evonik
Epodil® 759 by Evonik is a monofunctional reactive diluent. Possesses increased flexibility and is used to reduce the viscosity of epoxy resin systems. Designed for laminates, civil engineering...
view more
Applications
Epoxy, Epoxide Resin
Engineering / manufacturing
Buildings & constructions>Flooring
Conversion of composites & thermosets>Potting
...
1
2
Next >
Back to Top