The material selection platform
Polymer Additives
OK
The material selection platform
Polymer Additives
Welcome back
,
My Profile
My Subscriptions
My Courses & Tutorials
Logout
Subscribe to Newsletters
Login / Register
The material selection platform
Polymer Additives
Additives Database
Selection Resources
News & Feeds
SEARCH
OK
Home
Search site
Product Search
by SpecialChem
Share
Feedback
Get link
Copy
Save
Cette page a bien été ajoutée à vos favoris
View all pages saved
CONTINUE BROWSING
Products (
857
)
Documents (
0
)
News (
53
)
REFINE YOUR SEARCH
(
active filters)
52
products match your search
Detailed
List
Product Name
Supplier
Description
ACCUREL® GA301
Evonik
ACCUREL® GA301 by Evonik is a fast working anti-static agent and 50% glycerol monostearate-based masterbatch in LDPE carrier resin. Acts as a mold release agent and exhibits fast migration. Suitable...
view more
Applications
PE>LDPE
Injection molding - thermoplastics
Conversion of composites & thermosets>Sheet molding
ACCUREL® GA303
Evonik
ACCUREL® GA303 by Evonik is a cell stabilizer, especially for EVA foams. Provides fast anti-static performance for polyolefin-based films, sheets or injection molded parts. It delays the exchange of...
view more
Applications
PP
Other Rubber
PE
Other Thermoplastic>EVA
...
AMICURE® 101
Evonik
Amicure® 101 by Evonik acts as an amine curing agent. Used in fiberglass/epoxy filament, encapsulate stator and ignition coils, passive components and general-purpose electrical devices. Offers very...
view more
Applications
Epoxy, Epoxide Resin
Electrical markets
Conversion of composites & thermosets>Encapsulating
Ancamide® 350A
Evonik
Ancamide® 350A by Evonik is a standard reactive liquid polyamide curing agent for epoxy resins. It is suitable for encapsulation and castings. It provides low viscosity, higher imidazoline content and...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Encapsulating
Ancamide® 910
Evonik
Ancamide® 910 is a versatile and flexible hardener by Evonik. Used for electronic potting and encapsulation compounds. Offers very good flexibility/peel strength. Provides very good thermal shock...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® 1482
Evonik
Ancamine® 1482 by Evonik acts as a curing agent for liquid epoxy resins. Exhibits excellent chemical and heat resistance. Provides long pot life and can be mixed at room temperature. Ancamine® 1482...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Filament winding1
Laminating
Conversion of composites & thermosets>Potting
Ancamine® 1922A
Evonik
Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in electrical potting and encapsulation. Imparts very good thermal shock resistance. Provides...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® 2014FG
Evonik
Ancamine® 2014FG by Evonik is a latent curing agent based on a modified polyamine. It is used as an accelerator for dicyandiamide (DICY). It is a fine-grind version of Ancamine® 2014AS curing agent...
view more
Applications
Conversion of composites & thermosets>Potting
Polymer surface adhesion>Adhesion to substrates
Ancamine® 2264
Evonik
Ancamine® 2264 by Evonik is epoxy curing agent. It exhibits some of the beneficial properties of both cycloaliphatic and aromatic amines. It is an ideal alternative to aromatic diamines in the...
view more
Applications
Epoxy, Epoxide Resin
Pipes, Hoses & Fittings
Conversion of composites & thermosets>Resin transfer Molding
Conversion of composites & thermosets>Filament winding1
Ancamine® 2337S
Evonik
Ancamine® 2337S by Evonik is a modified aliphatic amine, a latent curing agent for epoxy resins. It offers very rapid reactivity, rapid green strength development and excellent shelf stability in...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Polymer Conversion>Dispersion
Polymer surface adhesion>Adhesion to substrates
Ancamine® 2441
Evonik
Ancamine® 2441 by Evonik is a modified polyamine-based crosslinking agent. Used in potting compounds. Offers very good reactivity. Provides improved green strength development. Possesses good...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Ancamine® 2442
Evonik
Ancamine® 2442 is a modified polyamine crosslinker by Evonik. Used in potting compounds. Offers very good reactivity. Provides improved green strength development. Possesses good formulation shelf...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Ancamine® 2450
Evonik
Ancamine® 2450 is a cycloaliphatic amine crosslinker by Evonik. Used in filament winding, wet lay-up laminating and potting compounds. Offers higher glass transition temperature. Possesses low...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Potting
Laminating
Conversion of composites & thermosets>Filament winding1
Ancamine® K61B
Evonik
Ancamine® K61B is tris-(dimethyla-minomethyl) phenol tri(2-ethyl hexoate) based crosslinking agent by Evonik. Used in electrical castings, potting, encapsulation and wet lay-up laminate systems...
view more
Applications
Conversion of composites & thermosets>Potting
Conversion of composites & thermosets>Encapsulating
Ancamine® T
Evonik
Ancamine® T by Evonik is a crosslinking agent based on N-(2-hydroxy ethyl)diethylene triamine. Acts as an ambient or elevated temperature curing agent for use with liquid epoxy resins. Possesses...
view more
Applications
Epoxy, Epoxide Resin
Conversion of composites & thermosets>Encapsulating
Conversion of composites & thermosets>Potting
Laminating
Ancamine® TEPA
Evonik
Ancamine® TEPA by Evonik acts as a crosslinking agent. It is a standard commercial grade of tetraethylene pentamine. It is less corrosive and has a lower vapor pressure and is also less hygroscopic...
view more
Applications
Conversion of composites & thermosets>Encapsulating
CUREZOL® 1B2MZ
Evonik
CUREZOL® 1B2MZ by Evonik is imidazole curing agent for epoxy resins. It is a low viscosity accelerator. Designed for potting and encapsulation in electrical and electronic applications. CUREZOL®...
view more
Applications
Epoxy, Epoxide Resin
Electronics / Computers
Electrical markets
Conversion of composites & thermosets>Potting
...
CUREZOL® 2E4MZ
Evonik
CUREZOL® 2E4MZ by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Offers single package latency from several hours to greater than six months. Possesses rapid...
view more
Applications
Epoxy, Epoxide Resin
Electronics / Computers
Electrical markets
Conversion of composites & thermosets>Encapsulating
...
CUREZOL® 2MA-OK
Evonik
CUREZOL® 2MA-OK by Evonik acts as an accelerator. Offers single package latency from several hours to greater than six months. It also functions as an accelerator in the reaction between epoxy...
view more
Applications
Epoxy, Epoxide Resin
Electronics / Computers
Electrical markets
Laminating
...
CUREZOL® 2MZ Azine
Evonik
CUREZOL® 2MZ Azine by Evonik is an accelerator in the reaction between epoxy resins and other curing agents. Exhibits rapid cure beyond activation temperatures. Suggested for casting, potting and...
view more
Applications
Epoxy, Epoxide Resin
Electrical markets
Electronics / Computers
Conversion of composites & thermosets>Encapsulating
...
1
2
3
Next >
Back to Top